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Air Cooling Heatsink for Disc type thyristor & rectifier diode
Air Cooling Heatsinks for single- and double-sided cooling disc type power SCR thyristors and rectifier diodes during their operation.
Heatsinks are used for semiconductor devices for currents from 100A to 6300A and voltages VDRM/VRRM up to 7000V. Heatsinks are used for disc (tablet type) semiconductors with сontact surface diameter from Ø19 mm to Ø100 mm. Features: natural air cooling and forced air cooling; corrosion-resistant aluminum alloy; low thermal resistance; easy installation with a mounting slot; can be either standard models can also be customizing.
For minimum electrical losses and maximum heat dissipation of the devices, the appropriate mounting force Fm specified in the power device specifications must be observed.
Current range of disc type SCR thyristors and rectifier diodes for which air heat sinks (coolers, radiators) are used: 100A, 150A, 160A, 200A, 250A, 300A, 320A, 400A, 500A, 600A, 630A, 800A, 1000A, 1250A, 1500A, 1600A, 2000A, 2500A, 3000A, 3200A, 4000A, 5000A, 6000A, 6300A.
Heat sinks are made of aluminum radiator profiles and do not require additional protective coating when used in different climatic conditions. Assembly of semiconductor devices (power diodes, thyristors) of tabular design with coolers is done by clamping bolts and traverse.
The contact surfaces of the heatsink and power device must have low roughness and flatness deviations. Before mounting the contact surfaces of the heatsink, current contact and semiconductor device should be wiped with a cloth soaked in alcohol (toluene, benzene, acetone) and it is recommended to lubricate with a thin layer of silicone-organic heat transfer paste (this is a recommendation and is not a prerequisite for installation).
Specifications and parameters, dimensions, drawings of air-cooled heat sink (radiator) are listed below. Our company provides a quality guarantee for air cooling heatsink of 2 years from the date of purchase.
When supplying heatsinks, if necessary, we provide technical passport. The final price of air cooling heatsink depends on the quantity, delivery terms, manufacturer, country of origin and form of payment.
SF11, SF12, SF13 Air Cooling Heatsink for single device specifications
| Type | Surface diameter | Applicable case surface | Mounting force P | Thermal resistance | Flow resistance | Weight | Application | Data sheet | ||
| Plate surface | Raised surface | Raised surface | Plate surface | kN | °C/W | Pa | kg | |||
| SF11 | Ø65 | Ø23, Ø27 | Ø19-Ø40 | Ø24-Ø27 | 3.3-20 | 0.090 | 45 | ≥ 2.5 | 200-800A devices, wind speed ≥ 4 m/sec |  |
| SF12 | Ø65 | Ø23, Ø27 | Ø19-Ø40 | Ø24-Ø27 | 3.3-20 | 0.090 | 45 | ≥ 3.0 | |
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| SF13 | Ø65 | Ø27, Ø31 | Ø34-Ø40 | Ø28-Ø32 | 5.5-25 | 0.071 | 55 | ≥ 4.1 | |
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| Type | Outline size | Arcpower lead size | Mounting size | Data sheet | ||||||||||||||
| L | D | H | L1 | D1 | H1 | D2 | H2 | H3 | d | d1 | a | c | e | g | i | k | ||
| SF11 | 170 | 110 | 125 | 60 | 40 | 8 | 80 | 15 | 22 | Ø13 | M3 | 20 | 20 | 55 | 30 | 6 | 20 | |
| SF12 | 200 | 110 | 125 | 60 | 40 | 8 | 80 | 15 | 22 | Ø13 | M3 | 20 | 20 | 55 | 30 | 6 | 20 | |
| SF13 | 220 | 120 | 130 | 60 | 40 | 8 | 90 | 15 | 45 | Ø13 | M3 | 20 | 20 | 64 | 53 | 6 | 20 | |
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SF14, SF15, SF16, SF17, SF17A, SF18, SF18A Air Cooling Heatsink for single device specifications
| Type | Surface diameter | Applicable case surface | Mounting force P | Thermal resistance | Flow resistance | Weight | Application | Data sheet | ||
| Plate surface | Raised surface | Raised surface | Plate surface | kN | °C/W | Pa | kg | |||
| SF14 | Ø82 | Ø32, Ø37 | Ø34-Ø45 | Ø32-Ø37 | 5.5-30 | 0.056 | 60 | ≥ 5.7 | 600-2000A devices, wind speed ≥ 4 m/sec. ≥ 1500A devices, wind speed ≥ 6 m/sec. |
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| SF15 | Ø82 | Ø32, Ø37, Ø42 | Ø40-Ø47 | Ø32-Ø42 | 10-34 | 0.048 | 65 | ≥ 8.0 | |
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| SF16 | Ø82 | - | Ø45-Ø65 | - | 15-40 | 0.037 | 70 | ≥ 11.0 | |
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| SF17 | Ø120 | - | Ø40-Ø73 | - | 15-47 | 0.030 | 75 | ≥ 14.0 | |
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| SF18 | Ø120 | - | Ø40-Ø73 | - | 15-47 | 0.030 | 75 | ≥ 14.0 | |
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| Type | Outline size | Arcpower lead size | Mounting size | Data sheet | |||||||||||||||||
| L | D | H | L1 | D1 | H1 | D2 | H2 | H3 | d | d1 | a | b | c | e | f | g | i | j | k | ||
| SF14 | 250 | 140 | 145 | 80 | 50 | 10 | 105 | 15 | 45 | Ø11 | M6 | 12.5 | 25 | 12.5 | 40 | 35 | 55 | 8 | 20 | 25 | |
| SF15 | 280 | 140 | 165 | 80 | 60 | 12 | 105 | 15 | 50 | Ø13 | M8 | 17.5 | 25 | 15 | 40 | 35 | 62 | 8 | 20 | 25 | |
| SF16 | 280 | 180 | 200 | 80 | 60 | 12 | 130 | 15 | 66 | Ø13 | M8 | 17.5 | 25 | 15 | 40 | 40 | 78 | 8 | 20 | 25 | |
| SF17 | 300 | 200 | 215 | 80 | 60 | 12 | 140 | 15 | 73 | Ø13 | M8 | 17.5 | 25 | 15 | 40 | 40 | 85 | 8 | 20 | 25 | |
| SF17A | 300 | 200 | 225 | 80 | 60 | 12 | 140 | 15 | 73 | Ø13 | M8 | 17.5 | 25 | 15 | 40 | 40 | 94 | 8 | 20 | 25 | |
| SF18 | 390 | 240 | 225 | 90 | 70 | 13 | 150 | 15 | 72 | Ø13 | M8 | 22.5 | 25 | 20 | 80 | 50 | 85 | 8 | 20 | 25 | |
| SF18A | 390 | 240 | 225 | 90 | 70 | 13 | 185 | 15 | 72 | Ø13 | M8 | 22.5 | 25 | 20 | 80 | 50 | 85 | 8 | 20 | 25 | |
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SF12BL Air Cooling Heatsink for double devices specifications
| Type | Surface diameter | Applicable case surface | Mounting force P | Thermal resistance | Flow resistance | Weight | Application | Data sheet |
| mm | mm | kN | °C/W | Pa | kg | |||
| SF12BL | Ø27 | Ø19-Ø25 | 3.3-20 | 0.150 | 45 | ≥ 3.0 | 200A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec | |
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SF13BL Air Cooling Heatsink for double devices specifications
| Type | Surface diameter | Applicable case surface | Mounting force P | Thermal resistance | Flow resistance | Weight | Application | Data sheet |
| mm | mm | kN | °C/W | Pa | kg | |||
| SF13BL | Ø66 | Ø34 | 5.5-25 | 0.130 | 45 | ≥ 4.1 | 200A-300A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec | |
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SF15BL Air Cooling Heatsink for double devices specifications
| Type | Surface diameter | Applicable case surface | Mounting force P | Thermal resistance | Flow resistance | Weight | Application | Data sheet |
| mm | mm | kN | °C/W | Pa | kg | |||
| SF15BL | Ø82 | Ø34-Ø45 | 10-34 | 0.090 | 45 | ≥ 8.0 | 300A-500A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec | |
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SF15CL Air Cooling Heatsink for double devices specifications
| Type | Surface diameter | Applicable case surface | Mounting force P | Thermal resistance | Flow resistance | Weight | Application | Data sheet |
| mm | mm | kN | °C/W | Pa | kg | |||
| SF15CL | Ø82 | Ø34-Ø45 | 10-34 | 0.090 | 45 | ≥ 8.0 | 300A-500A element assemblings, and inverse parallel connection power sets, wind speed ≥ 6m/sec | |
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For questions regarding the acquisition of Modules, SCR Thyristors, Diodes send an email request to:
And we will provide you a commercial offer for delivery. For a large number, we will provide an individual price!!!
We are open to manufacture products at our production facilities according to your requests and technical task.
The reliability of heat transfer and electrical contact between the mating surfaces of the thyristor and the cooler over the entire temperature range is ensured by mounting torque (clamping force).
Before assembly you should perform visual inspection (1) contact surfaces for mechanical damages and wipe (2), soaked with alcohol (toluene, gasoline, acetone).
After inspection, fix the current contacts (leads), install a pin to fix the alignment of the structure. To improve the parameters of heat transfer it is recommended to lubricate (3) a thin layer of silicone thermal conductive paste before the assembly (this is a recommendation and is not a prerequisite for installation). Install the thyristor (3), the second part of the cooler, the fiberglass insulator and the thrust washer.
To thread the traverse (4) and evenly tighten the nuts. Make sure no misalignment and evenness of the contact surfaces. When the parts are sufficiently clamped but moveable, we recommend placing the cooler on a flat surface and checking the tolerance for parallelism of the overall adjacent plane of the surfaces (5).
Clamp each nut in turn (about a quarter turn) to the stop (6). The amount of deflection of the traverse determines whether the achieved clamping force corresponds to the required one. After installation, the fasteners (nuts and washers) must be additionally secured against corrosion.
Quality Warranty
Each product is tested for the main parameters, and Test reports of the parameters for each product are provided.
Geography of partnership
Thyristor factory company manufactures and supplies power semiconductors to more than 50 countries around the world.
Logistics and Delivery
We deliver our products all over the world with the services of logistics companies: DHL, TNT, UPS, EMS, Fedex, Aramex. Products can be delivered by any means of transport: air, sea, rail and road.
JY FACTORY Semiconductors Manufacturing
Our products range includes rectifier diodes, phase control thyristors in disc and stud design, avalanche diodes and thyristors, fast switching, high frequency thyristors, fast recovery, welding and rotor diodes, triacs, bridge rectifiers, power modules (thyristor, diode, thyristor-diode, IGBT), and air and water heatsinks to them.
Power diodes and thyristors are produced for currents from 10A to 15000A, voltage range from 100V to 9000V. Power diode and thyristor modules are produced from 25A and up to 1250A, voltage range 400V – 4400V. The range of power semiconductors also includes equivalent, replacement, analogue and alternative semiconductor devices of global manufacturers.